FPC

Modular-Jack

HEADER

Board to Board

Cable

USB

Wafer

HDMI

SATA

D-SUB

back
next

862BXXG12-41

862BXXG12-41

ModelZIF

Pitch (mm)0.3

Mounting TypeSMT

Connect AngleRight Angle

FeaturesFront-Flip(Easy-on)

Contact Placebottom Contact

Contact Row1

Height (mm)1

Housing MaterialLCP

FlammabilityUL94V-0

Contact MaterialCopper Alloy

Shell Material

Contact Finish

Shell Finish

Insertion Force (N max.)

Withdrawal Force (N max.)

Durability (Cycles)

Fitting Nail MaterialCopper Alloy

Fitting Nail FinishTin

Screw Finish

Boardlock Finish

Rivet Finish

Screw Material

Boardlock Material

Rivet Material

Actuator MaterialLCP

Operaring Voltage(V)30

Contact Rating(A) 0.2

Contact Resistance(mΩ max.)40

Insulation Resistance(MΩ min.)500

Dielectric Withstanding Voltage(V /1 min.)250