FPC

Modular-Jack

HEADER

Board to Board

Cable

USB

Wafer

HDMI

SATA

D-SUB

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858DXXG1X-42

858DXXG1X-42

ModelZIF

Pitch (mm)0.5

Mounting TypeSMT

Connect AngleRight Angle

FeaturesFront-Flip(Easy-on)

Contact PlaceDual Contact

Contact Row2

Height (mm)1

Housing MaterialLCP

FlammabilityUL94V-0

Contact MaterialCopper Alloy

Shell Material

Contact Finish

Shell Finish

Insertion Force (N max.)

Withdrawal Force (N max.)

Durability (Cycles)

Fitting Nail MaterialBrass

Fitting Nail FinishTin

Screw Finish

Boardlock Finish

Rivet Finish

Screw Material

Boardlock Material

Rivet Material

Actuator MaterialLCP

Operaring Voltage(V)50

Contact Rating(A) 0.5

Contact Resistance(mΩ max.)40

Insulation Resistance(MΩ min.)50

Dielectric Withstanding Voltage(V /1 min.)200